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The method of Fine Scrap has been applied only by Terranix. By minimizing space to increase productivity, we have come to a conclusion that it can decrease the defect rate and competition.


Base Material	MCCL
No. of Layers	1 ~ 2 L
Board Thickness	26 ~ 88 [mil]	0.65 ~ 2.2 [mm]
Max. Boase Size	600 * 3.9 [mm]
Min. Pattern Width	4 [mil]	100 [㎛]
Min. Pattern Space	4 [mil]	100 [㎛]
Min. Drill Size	40 [mil]	1.0 [mm]
Surface Treatment	OSP


Base Material	CEM-3 , FR-4
No. of Layers	1 ~ 2 L
Board Thickness	20 ~ 40 [mil]	0.5 ~ 1.0 [mm]
Max. Boase Size	720 * 15 [mm]
Min. Pattern Width	4 [mil]	100 [㎛]
Min. Pattern Space	4 [mil]	100 [㎛]
Min. Drill Size	12 [mil]	0.3 [mm]
Surface Treatment	OSP